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                  6/8/12 wafer debinding machine for uv led debinding

                  Click:[1054] Publish Time:2022-12-13

                    6/8/12 wafer debinding machine for uv led debinding

                    Role: uvled decoupler for optical semiconductor materials UV film decoupling use.

                    Features: made of UV LED light source, tight structure low temperature, uniform exposure, small energy consumption, long service life, reach curing time UV lamp automatically shut down, to prevent personnel from taking material UV leakage, resulting in human injury.  

                    Light source: UV LED lamp  

                    uvled uncoupler luminous area: 200 * 200mm  

                    Light intensity intensity: 100-10000mw  

                    UV wavelength: 365/385/395/405+5nm  

                    Light intensity uniformity: 90% +  

                    Applicable product size: 200m*200mm UVLED uncoupler  

                    Irradiation method: bottom up irradiation, curing product tray bottom 

                    Cooling method: air-cooled or water-cooled  

                    Lifespan: 20,000 hours of LED lamp beads 

                    Irradiation height: 50-200m, any height adjustment, according to the actual use of customers  

                    uvled unglueing machine control mode: 

                    1、Automatic moving mode: the product is placed on the partition inside the box. Close the door automatically open the UV lamp (door frame is equipped with sensors automatically induction), to reach the curing time UV lamp automatically shut down waiting for manual pick up material.

                    2、Manual mode: after placing the product manually press the switch on the operation panel to open the UV lamp, reach the curing time UV lamp automatically off waiting for the personnel to take the material.